| Manufacturer Part | HSE-B18254-035H-00 |
|---|---|
| Manufacturer | CUI Devices |
| Description | HEAT SINK, EXTRUSION, TO-218, 25 |
| Category | Fans & Thermal Management Supplier | Ample Chip |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | HSE-B18254-035H-00 PDF |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 08 - Dec 12 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | HSE |
| Package: | Box |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-218 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.000" (25.40mm) |
| Width: | 1.638" (41.60mm) |
| Diameter: | - |
| Fin Height: | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | 10.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 4.03°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 7.50°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
LAN MODULE XFRMR 10GBASE-T SMD
HEAT SINK, EXTRUSION, TO-218, 25
IC OPAMP ISOLATION 1 CIRC 8DIPGW
DIP SWITCH
SWITCH THUMB HEX 0.1A 120V/28V
MOSFET N-CH 30V 15A/55A TO251A
TRANSDUCER 1-5VDC 50PSI
