| Manufacturer Part | COH-3114LVC-400-30 |
|---|---|
| Manufacturer | Taica Corporation |
| Description | THERMAL INTERFACE PAD, GAP PAD, |
| Category | Fans & Thermal Management Supplier | Ample Chip |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | COH-3114LVC-400-30 PDF |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 08 - Dec 12 2025 |
In Stock Min.: 1 Mult.: 1
Not satisfied with the price? Want a lower wholesale price? Please send RFQ, and we will respond immediately
| Type | Description |
|---|---|
| Series: | λGEL™ COH |
| Package: | Bulk |
| Part Status: | Active |
| Usage: | - |
| Type: | Gel Pad, Sheet |
| Shape: | Square |
| Outline: | 400.00mm x 400.00mm |
| Thickness: | 0.118" (3.00mm) |
| Material: | Silicone Gel |
| Adhesive: | Tacky - Both Sides |
| Backing, Carrier: | - |
| Color: | Gray |
| Thermal Resistivity: | - |
| Thermal Conductivity: | 8.2W/m-K |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
FIXED IND 3.3UH 4.1A 57.8 MOHM
THERMAL INTERFACE PAD, GAP PAD,
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IC FLASH 1GBIT PARALLEL 64FBGA
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